Publication:
Utilizing Keep-Out Zone (KOZ) of Through Silicon Via (TSV) for ESD protection devices in 3D stacking integrated circuits
Date
| dc.contributor.author | Chen, Shih-Hung | |
| dc.contributor.author | Thijs, Steven | |
| dc.contributor.author | Linten, Dimitri | |
| dc.contributor.author | Groeseneken, Guido | |
| dc.contributor.imecauthor | Chen, Shih-Hung | |
| dc.contributor.imecauthor | Thijs, Steven | |
| dc.contributor.imecauthor | Linten, Dimitri | |
| dc.contributor.imecauthor | Groeseneken, Guido | |
| dc.contributor.orcidimec | Thijs, Steven::0000-0003-2889-8345 | |
| dc.contributor.orcidimec | Linten, Dimitri::0000-0001-8434-1838 | |
| dc.date.accessioned | 2021-10-20T10:14:42Z | |
| dc.date.available | 2021-10-20T10:14:42Z | |
| dc.date.issued | 2012 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/20441 | |
| dc.source.beginpage | 391 | |
| dc.source.conference | International ESD Workshop - IEW | |
| dc.source.conferencedate | 14/05/2012 | |
| dc.source.conferencelocation | Oud-Turnhout Belgium | |
| dc.source.endpage | 399 | |
| dc.title | Utilizing Keep-Out Zone (KOZ) of Through Silicon Via (TSV) for ESD protection devices in 3D stacking integrated circuits | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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