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3D stacking of microwave modules for high-density packaging
Publication:
3D stacking of microwave modules for high-density packaging
Date
2008-08
Dissertation
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17900.pdf
7.71 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Posada Quijano, Guillermo
Journal
Abstract
Description
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2111
since deposited on 2021-10-17
Acq. date: 2025-10-23
Citations
Metrics
Views
2111
since deposited on 2021-10-17
Acq. date: 2025-10-23
Citations