Publication:

Impact of mechanical stress on 3-D NAND current conduction

Date

2020
Journal article
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dc.contributor.authorKruv, Anastasiia
dc.contributor.authorArreghini, Antonio
dc.contributor.authorVerreck, Devin
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVan den Bosch, Geert
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorRosmeulen, Maarten
dc.contributor.imecauthorKruv, Anastasiia
dc.contributor.imecauthorArreghini, Antonio
dc.contributor.imecauthorVerreck, Devin
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVan den Bosch, Geert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorRosmeulen, Maarten
dc.contributor.orcidimecArreghini, Antonio::0000-0002-7493-9681
dc.contributor.orcidimecVerreck, Devin::0000-0002-3833-5880
dc.contributor.orcidimecVan den Bosch, Geert::0000-0001-9971-6954
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecRosmeulen, Maarten::0000-0002-3663-7439
dc.date.accessioned2021-10-28T23:33:25Z
dc.date.available2021-10-28T23:33:25Z
dc.date.issued2020
dc.identifier.issn0018-9383
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35421
dc.identifier.urlhttps://ieeexplore.ieee.org/abstract/document/9210045
dc.source.beginpage4891
dc.source.endpage4
dc.source.issue11
dc.source.journalIEEE Transactions on Electron Devices
dc.source.volume67
dc.title

Impact of mechanical stress on 3-D NAND current conduction

dc.typeJournal article
dspace.entity.typePublication
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