Publication:
Strain engineering and device performance: benefit or compromise?
Date
| dc.contributor.author | Claeys, Cor | |
| dc.contributor.author | Simoen, Eddy | |
| dc.contributor.imecauthor | Simoen, Eddy | |
| dc.contributor.orcidimec | Simoen, Eddy::0000-0002-5218-4046 | |
| dc.date.accessioned | 2021-10-16T15:20:00Z | |
| dc.date.available | 2021-10-16T15:20:00Z | |
| dc.date.issued | 2007 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11879 | |
| dc.source.conference | IEEE Electron and Devices Colloquium on Next generation Device Technologies | |
| dc.source.conferencedate | 23/02/2007 | |
| dc.source.conferencelocation | Santa Clara, CA USA | |
| dc.title | Strain engineering and device performance: benefit or compromise? | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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