Publication:
3D system integration - opportunities and challenges
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-18T15:20:58Z | |
| dc.date.available | 2021-10-18T15:20:58Z | |
| dc.date.issued | 2010-12 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/16744 | |
| dc.source.conference | 7th International 3-D Architectures for Semiconductor Integration and Packaging Conference and Exhibition | |
| dc.source.conferencedate | 8/12/2010 | |
| dc.source.conferencelocation | Burlingame, CA USA | |
| dc.title | 3D system integration - opportunities and challenges | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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