The stud grid array, a low cost solution for packaging and assembling high pin count devices

dc.contributor.author	Beyne, Eric
dc.contributor.author	Christiaens, Filip
dc.contributor.author	Roggen, Jean
dc.contributor.author	Van Puymbroeck, Jan
dc.contributor.author	Dumoulin, A.
dc.contributor.author	Boone, L.
dc.contributor.author	Heerman, M.
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.imecauthor	Van Puymbroeck, Jan
dc.date.accessioned	2021-09-29T13:04:14Z
dc.date.available	2021-09-29T13:04:14Z
dc.date.embargo	9999-12-31
dc.date.issued	1995
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/521
dc.source.beginpage	70
dc.source.conference	VLSI Packaging Workshop: Spotlight BGA
dc.source.conferencedate	16/10/1995
dc.source.conferencelocation	Monterey, CA USA
dc.source.endpage	72
dc.title	The stud grid array, a low cost solution for packaging and assembling high pin count devices
dc.type	Proceedings paper
dspace.entity.type	Publication
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