Publication:
Fabrication and testing of a wafer-level chip encapsulation method for implantable devices
Date
| dc.contributor.author | Op de Beeck, Maaike | |
| dc.contributor.imecauthor | Op de Beeck, Maaike | |
| dc.contributor.orcidimec | Op de Beeck, Maaike::0000-0002-2700-6432 | |
| dc.date.accessioned | 2021-10-18T19:51:04Z | |
| dc.date.available | 2021-10-18T19:51:04Z | |
| dc.date.issued | 2010 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17736 | |
| dc.source.conference | IMAPS Autumn Event | |
| dc.source.conferencedate | 25/11/2010 | |
| dc.source.conferencelocation | Leuven Belgium | |
| dc.title | Fabrication and testing of a wafer-level chip encapsulation method for implantable devices | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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