Publication:
Block level and package level thermal assessment for back side power delivery network.
| dc.contributor.author | Lofrano, Melina | |
| dc.contributor.author | Oprins, Herman | |
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | Witters, Liesbeth | |
| dc.contributor.author | Jourdain, Anne | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Lofrano, Melina | |
| dc.contributor.imecauthor | Oprins, Herman | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | Jourdain, Anne | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Witters, Liesbeth | |
| dc.contributor.orcidimec | Lofrano, Melina::0000-0002-3930-6459 | |
| dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
| dc.contributor.orcidimec | Cherman, Vladimir::0000-0002-8068-9236 | |
| dc.contributor.orcidimec | Jourdain, Anne::0000-0002-7610-0513 | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Witters, Liesbeth::0000-0002-0772-5501 | |
| dc.date.accessioned | 2025-04-17T13:59:20Z | |
| dc.date.available | 2024-12-07T16:57:02Z | |
| dc.date.available | 2025-04-17T13:59:20Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/ECTC51529.2024.00166 | |
| dc.identifier.eisbn | 979-8-3503-7598-5 | |
| dc.identifier.isbn | 979-8-3503-7599-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/44939 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 1036 | |
| dc.source.conference | IEEE 74th Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 28-31, 2024 | |
| dc.source.conferencelocation | Denver | |
| dc.source.endpage | 1043 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 8 | |
| dc.title | Block level and package level thermal assessment for back side power delivery network. | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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