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Conference contributions
Comprehensive study of postprocessed copper heat sinks on smart power drivers for thermal SOA improvement
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Comprehensive study of postprocessed copper heat sinks on smart power drivers for thermal SOA improvement
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Date
2005
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Van den Bosch, Geert
;
Driessens, Evelien
;
Webers, Tomas
;
Elattari, Brahim
;
Wojchiechowski, Dominique
;
Gassot, Pierre
;
Moens, Peter
;
Groeseneken, Guido
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1950
since deposited on 2021-10-16
Acq. date: 2026-07-16
Citations
Statistics
Views
1950
since deposited on 2021-10-16
Acq. date: 2026-07-16
Citations