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The Minipackage: a flexible wafer-level packaging solution for MEMS

Date

2004
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dc.contributor.authorDe Moor, Piet
dc.contributor.authorBaert, Kris
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorDu Bois, Bert
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorJourdain, Anne
dc.contributor.authorVan Hoof, Chris
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorDu Bois, Bert
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecDu Bois, Bert::0000-0003-0147-1296
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.date.accessioned2021-10-15T13:04:33Z
dc.date.available2021-10-15T13:04:33Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8778
dc.source.conferenceIMAPS 6th Workshop on Packaging of MEMS
dc.source.conferencedate18/11/2004
dc.source.conferencelocationLong Beach, CA USA
dc.title

The Minipackage: a flexible wafer-level packaging solution for MEMS

dc.typeOral presentation
dspace.entity.typePublication
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