Publication:
Thermomechanical challenges for device interconnect and advanced packaging
Date
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.orcidimec | Gonzalez, Mario::0000-0003-4374-4854 | |
| dc.date.accessioned | 2021-10-28T22:01:06Z | |
| dc.date.available | 2021-10-28T22:01:06Z | |
| dc.date.issued | 2020 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/35185 | |
| dc.source.conference | IEEE International Interconnect Technology Conference (IEEE IITC) | |
| dc.source.conferencedate | 5/10/2020 | |
| dc.source.conferencelocation | San José California USA | |
| dc.title | Thermomechanical challenges for device interconnect and advanced packaging | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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