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At-speed delay testing of inter-die connections of 2.5D- and 3D-SICs
Publication:
At-speed delay testing of inter-die connections of 2.5D- and 3D-SICs
Date
2015-05
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Shibin, Konstantin
;
Chickermane, Vivek
;
Keller, Brion
;
Papameletis, Christos
;
Marinissen, Erik Jan
Journal
Abstract
Description
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1920
since deposited on 2021-10-22
Acq. date: 2025-10-24
Citations
Metrics
Views
1920
since deposited on 2021-10-22
Acq. date: 2025-10-24
Citations