Publication:

D-Band Air-Filled Substrate Integrated Waveguide (AFSIW) and Broadband Stripline to AFSIW Launcher Embedded in Multi-Layer PCBs

Date

2023
Journal article
https://doi.org/10.1109/LMWT.2023.3267769
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dc.contributor.authorSinha, Siddhartha
dc.contributor.authorTrischler, Heinrich
dc.contributor.authorOcket, Ilja
dc.contributor.authorSchaffler, Erich
dc.contributor.imecauthorSinha, Siddhartha
dc.contributor.imecauthorOcket, Ilja
dc.contributor.orcidimecSinha, Siddhartha::0000-0003-4025-2854
dc.contributor.orcidimecOcket, Ilja::0000-0002-1503-7397
dc.date.accessioned2023-11-23T13:13:19Z
dc.date.available2023-06-13T20:30:57Z
dc.date.available2023-11-23T13:13:19Z
dc.date.issued2023
dc.identifier.doi10.1109/LMWT.2023.3267769
dc.identifier.issn2771-957X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/41730
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage795
dc.source.endpage798
dc.source.issue6
dc.source.journalIEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERS
dc.source.numberofpages4
dc.source.volume33
dc.title

D-Band Air-Filled Substrate Integrated Waveguide (AFSIW) and Broadband Stripline to AFSIW Launcher Embedded in Multi-Layer PCBs

dc.typeJournal article
dspace.entity.typePublication
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