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CDM protection of a 3D TSV memory IC with a 100 GB/s Wide I/O data bus

Date

2014-09
Proceedings Paper
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dc.contributor.authorNagata, Makoto
dc.contributor.authorTakaya, Satoshi
dc.contributor.authorIkeda, Hiroaki
dc.contributor.authorLinten, Dimitri
dc.contributor.authorScholz, Mirko
dc.contributor.authorChen, Shih-Hung
dc.contributor.authorHasegawa, Keiichi
dc.contributor.authorShintani, Taizo
dc.contributor.authorSawada, Masanori
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorChen, Shih-Hung
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.date.accessioned2021-10-22T04:11:23Z
dc.date.available2021-10-22T04:11:23Z
dc.date.issued2014-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24307
dc.source.beginpage61
dc.source.conferenceEOS/ESD Symposium Proceedings
dc.source.conferencedate7/09/2014
dc.source.conferencelocationTucson, AZ USA
dc.source.endpage67
dc.title

CDM protection of a 3D TSV memory IC with a 100 GB/s Wide I/O data bus

dc.typeProceedings paper
dspace.entity.typePublication
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