Publication:

Die level thinning down to 15μm thickness

Date

2007-12
Proceedings Paper
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dc.contributor.authorCotrin Teixeira, Ricardo
dc.contributor.authorTorfs, Tom
dc.contributor.authorDe Munck, Koen
dc.contributor.authorDe Moor, Piet
dc.contributor.authorBaert, Kris
dc.contributor.authorVan Hoof, Chris
dc.contributor.imecauthorTorfs, Tom
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecTorfs, Tom::0000-0002-1302-3346
dc.contributor.orcidimecDe Munck, Koen::0000-0003-0922-3860
dc.contributor.orcidimecVan Hoof, Chris::0000-0002-4645-3326
dc.date.accessioned2021-10-16T15:24:01Z
dc.date.available2021-10-16T15:24:01Z
dc.date.issued2007-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11908
dc.source.conferenceForum 2007 Be Flexible
dc.source.conferencedate5/12/2007
dc.source.conferencelocationMünchen Germany
dc.title

Die level thinning down to 15μm thickness

dc.typeProceedings paper
dspace.entity.typePublication
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