Publication:

Ballistic heat transport in MoS<sub>2</sub> monolayers

Date

2023
Proceedings Paper
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dc.contributor.authorDuflou, Rutger
dc.contributor.authorHoussa, Michel
dc.contributor.authorAfzalian, Aryan
dc.contributor.imecauthorDuflou, Rutger
dc.contributor.imecauthorHoussa, Michel
dc.contributor.imecauthorAfzalian, Aryan
dc.contributor.orcidimecDuflou, Rutger::0000-0002-0357-1293
dc.contributor.orcidimecHoussa, Michel::0000-0003-1844-3515
dc.contributor.orcidimecAfzalian, Aryan::0000-0002-5260-0281
dc.date.accessioned2024-03-06T09:56:31Z
dc.date.available2024-01-11T17:16:19Z
dc.date.available2024-03-06T09:56:31Z
dc.date.issued2023
dc.identifier.eisbn978-4-86348-803-8
dc.identifier.issn1946-1569
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43387
dc.publisherIEEE
dc.source.beginpage177
dc.source.conferenceInternational Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
dc.source.conferencedateSEP 27-29, 2023
dc.source.conferencelocationKobe
dc.source.endpage180
dc.source.journalN/A
dc.source.numberofpages4
dc.title

Ballistic heat transport in MoS2 monolayers

dc.typeProceedings paper
dspace.entity.typePublication
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