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Verifying thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions

Date

2010
Proceedings Paper
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dc.contributor.authorMarchal, Pol
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorLimaye, Paresh
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorCherman, Vladimir
dc.contributor.authorOprins, Herman
dc.contributor.authorLabie, Riet
dc.contributor.authorVandevelde, Bart
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.date.accessioned2021-10-18T18:45:27Z
dc.date.available2021-10-18T18:45:27Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17570
dc.source.beginpage15
dc.source.conferenceInternational Symposium on VLSI Design Automation and Test - VLSI-DAT
dc.source.conferencedate26/04/2010
dc.source.conferencelocationHsinchu Taiwan
dc.source.endpage16
dc.title

Verifying thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions

dc.typeProceedings paper
dspace.entity.typePublication
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