Publication:
Recent packaging and board assembly challenges for high-reliabliity applications
Date
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2021-10-21T13:42:11Z | |
| dc.date.available | 2021-10-21T13:42:11Z | |
| dc.date.issued | 2013 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/23288 | |
| dc.source.conference | Inemi Automotive Workshop | |
| dc.source.conferencedate | 9/09/2013 | |
| dc.source.conferencelocation | Grenoble France | |
| dc.title | Recent packaging and board assembly challenges for high-reliabliity applications | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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