Publication:

Intermetallic Compounds as Alternatives to Copper for Advanced Interconnect Metallization

Date

2023

Proceedings Paper

https://doi.org/10.1109/IITC/MAM57687.2023.10154839

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Author(s)

Adelmann, Christoph

;

Soulie, Jean-Philippe

;

Scheerder, Jeroen

;

Fleischmann, Claudia

;

Sankaran, Kiroubanand

;

Pourtois, Geoffrey

;

;

Journal

N/A

Metrics

758 since deposited on 2023-08-07

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Acq. date: 2026-01-05