Publication:

Intermetallic Compounds as Alternatives to Copper for Advanced Interconnect Metallization

Date

2023
Proceedings Paper
https://doi.org/10.1109/IITC/MAM57687.2023.10154839
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Author(s)

Adelmann, Christoph  
;
Soulie, Jean-Philippe
;
Scheerder, Jeroen  
;
Fleischmann, Claudia  
;
Sankaran, Kiroubanand  
;
Pourtois, Geoffrey  
;
Swerts, Johan  
;
Tokei, Zsolt  

Journal

N/A

Abstract

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751 since deposited on 2023-08-07
Acq. date: 2025-10-27

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751 since deposited on 2023-08-07
Acq. date: 2025-10-27

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