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Conference contributions
Impact of different level copper interconnection on hot carrier lifetime of 0.18μm CMOS process
Publication:
Impact of different level copper interconnection on hot carrier lifetime of 0.18μm CMOS process
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Date
2004
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wan, Xinggong
;
De Jaeger, Brice
;
Han, Yongzhao
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Acq. date: 2025-12-15
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Acq. date: 2025-12-15
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Downloads
2
since deposited on 2021-10-15
Acq. date: 2025-12-15
Views
1874
since deposited on 2021-10-15
1
last month
Acq. date: 2025-12-15
Citations