Publication:

Addressing Key Process Roadblocks to Enable Epitaxial MX<sub>2</sub> and Layer Transfer in a 300mm Fab

Date

2025
Proceedings Paper
https://doi.org/10.1109/vlsitsa64674.2025.11046891
Simple item page Full metadata Statistics
 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-1461-5703
cris.virtual.orcid0000-0002-5781-7594
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-0282-8528
cris.virtual.orcid0000-0002-9647-7967
cris.virtual.orcid0000-0002-1401-0141
cris.virtual.orcid0000-0002-2356-5915
cris.virtual.orcid0000-0003-1533-7055
cris.virtualsource.departmentab262bc7-16ae-4482-b008-e896f1bbfe6a
cris.virtualsource.department5a858383-b569-42cd-8788-c2e90735c7e5
cris.virtualsource.departmentc49fd1e2-a117-4839-80dc-0e884525b195
cris.virtualsource.departmentb75defcd-5254-4816-bb35-ccd8c5db1cb0
cris.virtualsource.department7e8c96eb-907f-48fd-b267-c70469907fb2
cris.virtualsource.department6495c3c6-2d2d-45c2-ac42-44989a0f1b1a
cris.virtualsource.department2278f1c0-d873-46fa-9ffd-a7813ebb3f50
cris.virtualsource.department2fc65eb2-c2f1-4505-bb09-96f2d0aa6ce9
cris.virtualsource.orcidab262bc7-16ae-4482-b008-e896f1bbfe6a
cris.virtualsource.orcid5a858383-b569-42cd-8788-c2e90735c7e5
cris.virtualsource.orcidc49fd1e2-a117-4839-80dc-0e884525b195
cris.virtualsource.orcidb75defcd-5254-4816-bb35-ccd8c5db1cb0
cris.virtualsource.orcid7e8c96eb-907f-48fd-b267-c70469907fb2
cris.virtualsource.orcid6495c3c6-2d2d-45c2-ac42-44989a0f1b1a
cris.virtualsource.orcid2278f1c0-d873-46fa-9ffd-a7813ebb3f50
cris.virtualsource.orcid2fc65eb2-c2f1-4505-bb09-96f2d0aa6ce9
dc.contributor.authorGhosh, Souvik
dc.contributor.authorMedina Silva, Henry
dc.contributor.authorSmets, Quentin
dc.contributor.authorSchram, Tom
dc.contributor.authorGroven, Benjamin
dc.contributor.authorBrems, Steven
dc.contributor.authorLockhart de la Rosa, Cesar Javier
dc.contributor.authorKar, Gouri Sankar
dc.date.accessioned2026-10-15T09:11:31Z
dc.date.available2026-10-15T09:11:31Z
dc.date.createdwos2026
dc.date.issued2025
dc.description.abstractWe present our efforts to facilitate 300mm MX2 growth on sapphire and completely automate the layer transfer module. Two concepts are presented; a collective die-to wafer approach (CoD2W), and a 300mm wafer-to-wafer approach (W2W), both with the vision of enabling MX2 integration in foundries for BEOL and/or FEOL applications.
dc.description.wosFundingTextCoD2W and W2W MX2 growth and layer transfer work was done within the IMEC IIAP core CMOS program with funding from EU Graphene Flagship grant 952792. Efforts towards growth and transfer from 200mm sapphire is executed through the Horizon Europe Research and Innovation Program under the 2D Pilot Line grant 101189797.
dc.identifier.doi10.1109/vlsitsa64674.2025.11046891
dc.identifier.isbn979-8-3315-4313-6
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/60560
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.source.conferenceInternational VLSI Symposium on Technology, Systems and Applications (VLSI TSA)
dc.source.conferencedate2025-04-21
dc.source.conferencelocationHsinchu
dc.source.journal2025 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI TSA
dc.source.numberofpages2
dc.title

Addressing Key Process Roadblocks to Enable Epitaxial MX2 and Layer Transfer in a 300mm Fab

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2026-09-07
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-09-07
Files
Publication available in collections:
Conference contributions