Publication:
Co-Integration challenges for 3D-TSV and advanced devices
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-19T12:35:17Z | |
| dc.date.available | 2021-10-19T12:35:17Z | |
| dc.date.issued | 2011 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18575 | |
| dc.source.conference | Semicon West, "3D in the Deep Submicron Era" Session | |
| dc.source.conferencedate | 13/07/2011 | |
| dc.source.conferencelocation | San Francisco, CA USA | |
| dc.title | Co-Integration challenges for 3D-TSV and advanced devices | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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