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Enabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systems

Date

2019
Meeting abstract
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dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorSuhard, Samuel
dc.contributor.authorBex, Pieter
dc.contributor.authorIacovo, Serena
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPeng, Lan
dc.contributor.authorKennes, Koen
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T16:03:19Z
dc.date.available2021-10-27T16:03:19Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33796
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8811420
dc.source.beginpage607
dc.source.conference2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate28/05/2019
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage613
dc.title

Enabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systems

dc.typeMeeting abstract
dspace.entity.typePublication
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