Publication:

A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch

Date

2018
Proceedings Paper
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dc.contributor.authorPodpod, Arnita
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorDuval, Fabrice
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorGonzalez, Mario
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.accessioned2021-10-26T01:24:18Z
dc.date.available2021-10-26T01:24:18Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31548
dc.identifier.urlhttps://ieeexplore.ieee.org/abstract/document/8429576/
dc.source.beginpage370
dc.source.conference68th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2018
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage378
dc.title

A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch

dc.typeProceedings paper
dspace.entity.typePublication
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