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Interactions of double patterning technology with wafer processing, OPC and design flows
Publication:
Interactions of double patterning technology with wafer processing, OPC and design flows
Date
2008
Proceedings Paper
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16312.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Lucas, Kevin
;
Cork, Chris
;
Miloslavsky, Alex
;
Luk-Pat, Gerry
;
Barnes, Levi
;
Hapli, John
;
Lewellen, John
;
Rollins, Greg
;
Wiaux, Vincent
;
Verhaegen, Staf
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1930
since deposited on 2021-10-17
Acq. date: 2025-10-23
Citations
Metrics
Views
1930
since deposited on 2021-10-17
Acq. date: 2025-10-23
Citations