Publication:
Reliability and failure analysis of SnAgCu solder interconnections on NiAu surface finish
Date
| dc.contributor.author | Ratchev, Petar | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.date.accessioned | 2021-10-15T06:20:28Z | |
| dc.date.available | 2021-10-15T06:20:28Z | |
| dc.date.issued | 2003 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8061 | |
| dc.source.beginpage | 113 | |
| dc.source.conference | Proceedings of the 10th Int. Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA | |
| dc.source.conferencedate | 7/07/2003 | |
| dc.source.conferencelocation | Singapore | |
| dc.source.endpage | 116 | |
| dc.title | Reliability and failure analysis of SnAgCu solder interconnections on NiAu surface finish | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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