Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Articles
Die-to-die adhesive bonding procedure for evanescently-coupled photonic devices
Publication:
Die-to-die adhesive bonding procedure for evanescently-coupled photonic devices
Date
2011-05
Journal article
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
22965.pdf
1.61 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Stankovic, Stevan
;
Jones, R.
;
Heck, J.
;
Sysak, M.
;
Van Thourhout, Dries
;
Roelkens, Gunther
Journal
Electrochemical and Solid-State Letters
Abstract
Description
Metrics
Views
1941
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations
Metrics
Views
1941
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations