Publication:

Integrated clean for TSV: comparison between dry process and wet processes and their electrical qualification

Date

2016
Proceedings Paper
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dc.contributor.authorSuhard, Samuel
dc.contributor.authorLi, Yunlong
dc.contributor.authorIwasaki, Akihisa
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorDraper, Simon
dc.contributor.authorMizutani, Atsushi
dc.contributor.authorDory, Thomas
dc.contributor.authorHolsteyns, Frank
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.date.accessioned2021-10-23T15:20:07Z
dc.date.available2021-10-23T15:20:07Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27364
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7861517/
dc.source.beginpage441
dc.source.conferenceIEEE 18th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate30/11/2016
dc.source.conferencelocationSingapore Singapore
dc.source.endpage444
dc.title

Integrated clean for TSV: comparison between dry process and wet processes and their electrical qualification

dc.typeProceedings paper
dspace.entity.typePublication
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