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Interconnect/Memory Co-Design and Co-Optimization Using Differential Transmission Lines

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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-3545-3424
cris.virtualsource.department91c597e4-ad90-4bf7-8c61-2e988307fee3
cris.virtualsource.department5345513e-14d5-47e9-a494-1dda4ed18864
cris.virtualsource.orcid91c597e4-ad90-4bf7-8c61-2e988307fee3
cris.virtualsource.orcid5345513e-14d5-47e9-a494-1dda4ed18864
dc.contributor.authorPei, Zhenlin
dc.contributor.authorLiu, Hsiao-Hsuan
dc.contributor.authorMayahinia, Mahta
dc.contributor.authorTahoori, Mehdi
dc.contributor.authorCatthoor, Francky
dc.contributor.authorTokei, Zsolt
dc.contributor.authorDubey, Prashant
dc.contributor.authorPan, Chenyun
dc.date.accessioned2026-01-22T13:52:15Z
dc.date.available2026-01-22T13:52:15Z
dc.date.createdwos2025-09-14
dc.date.issued2025-09-01
dc.description.abstractAs technology scales down, the performance–power–area (PPA) of static random access memory (SRAM) is increasingly constrained by interconnects due to the presence of large parasitic capacitance and resistance within these structures. This article presents a co-optimization and co-design framework that integrates technology, interconnect, circuit, cache memory, and workload to optimize the overall PPA of the computing cache system through various emerging interconnect technologies under software and hardware conditions. Moreover, we present the differential transmission line (DTL), which is utilized as a hybrid with conventional wires with repeater insertion. The proposed methodology enables the identification of the optimal design, thereby facilitating the reduction of interconnect energy and delay, considering synthetic/realistic workloads and comparing DTL against traditional repeater insertion methods based on metrics of PPA, including the energy–delay–area product (EDAP) and energy–delay product (EDP), for the computing cache system. A thorough design space exploration is conducted, utilizing validated experimental subarrays at the deep scale across state-of-the-art technology nodes. Moreover, the case study assesses a range of cache system parameters, emphasizing the potential of DTL interconnect technologies to enhance cache memory PPA.
dc.description.wosFundingTextThis work was supported in part by the Interuniversity Microelectronics Centre (IMEC); in part by the Advanced Scientific Computing Research (ASCR) Program of the U.S. Department of Energy (DOE) under Award DE-SC0022881; and in part by the National Science Foundation (NSF) under Grant CCF-2219753.
dc.identifier.doi10.1109/TVLSI.2025.3595818
dc.identifier.issn1063-8210
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/58707
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage3118
dc.source.endpage3130
dc.source.issue11
dc.source.journalIEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS
dc.source.numberofpages13
dc.source.volume33
dc.subject.keywordsPERFORMANCE
dc.title

Interconnect/Memory Co-Design and Co-Optimization Using Differential Transmission Lines

dc.typeJournal article
dspace.entity.typePublication
imec.internal.crawledAt2025-10-22
imec.internal.sourcecrawler
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