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Low temperature flip-chip process using ICA and NCA (isotropivally and non-conductive adhesive) for flexible displays application

Date

2002
Proceedings Paper
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dc.contributor.authorVanfleteren, Jan
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorPodprocky, T.
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-10-14T23:47:58Z
dc.date.available2021-10-14T23:47:58Z
dc.date.embargo9999-12-31
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6997
dc.source.beginpage139
dc.source.conferenceProceedings of the 4th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate10/12/2002
dc.source.conferencelocationSingapore
dc.source.endpage143
dc.title

Low temperature flip-chip process using ICA and NCA (isotropivally and non-conductive adhesive) for flexible displays application

dc.typeProceedings paper
dspace.entity.typePublication
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