Publication:

Influence of test structure design on stress-induced-voiding using an experimentally validated finite element modeling approach

Date

2011
Journal article
Simple item page Full metadata Statistics
 
dc.contributor.authorLofrano, Melina
dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorWilson, Chris
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorWilson, Chris
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-19T15:41:25Z
dc.date.available2021-10-19T15:41:25Z
dc.date.issued2011
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19327
dc.source.beginpage1578
dc.source.endpage1581
dc.source.issue9_11
dc.source.journalMicroelectronics Reliability
dc.source.volume51
dc.title

Influence of test structure design on stress-induced-voiding using an experimentally validated finite element modeling approach

dc.typeJournal article
dspace.entity.typePublication
Files
Publication available in collections:
Articles