Publication:
Layer and Stacking Effects on Transport Properties in Steep-Slope Cold-Metal-Source FETs
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-4157-1956 | |
| cris.virtual.orcid | 0009-0007-1972-338X | |
| cris.virtual.orcid | 0000-0002-5260-0281 | |
| cris.virtualsource.department | f9b525b6-66d0-4e40-8dd4-46fc733e347c | |
| cris.virtualsource.department | 69351920-36ea-45bc-9073-c081202aefde | |
| cris.virtualsource.department | 7e65e670-a519-4d5e-82e5-8931848f4edc | |
| cris.virtualsource.orcid | f9b525b6-66d0-4e40-8dd4-46fc733e347c | |
| cris.virtualsource.orcid | 69351920-36ea-45bc-9073-c081202aefde | |
| cris.virtualsource.orcid | 7e65e670-a519-4d5e-82e5-8931848f4edc | |
| dc.contributor.author | Chang, Chiao-Yu | |
| dc.contributor.author | Soree, Bart | |
| dc.contributor.author | Afzalian, Aryan | |
| dc.date.accessioned | 2026-09-14T11:15:29Z | |
| dc.date.available | 2026-09-14T11:15:29Z | |
| dc.date.createdwos | 2026 | |
| dc.date.issued | 2025 | |
| dc.description.abstract | We investigate the impacts of layer number and heterostructure stacking on the transport of 2D cold-metal-source FETs within the DFT-NEGF framework using our NEGF solver, ATOMOS, which enables electron-phonon coupling analysis. Our simulations demonstrate that optimized NbS2/WS2 stacking reduces the van der Waals gap, enhancing on-current, while additional cold-metal layers introduce density of states near the Fermi level, further improving the on-current. This study presents an effective design strategy for cold-source materials and contacts to achieve steep-slope transport. | |
| dc.description.wosFundingText | This work has received funding from the European Commission-EU Attoswitch project under grant agreement n. 101135571. | |
| dc.identifier.doi | 10.1109/sispad66650.2025.11186390 | |
| dc.identifier.isbn | 979-8-3315-4884-1 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/60340 | |
| dc.language.iso | eng | |
| dc.provenance.editstepuser | greet.vanhoof@imec.be | |
| dc.publisher | IEEE | |
| dc.source.beginpage | 1 | |
| dc.source.conference | International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) | |
| dc.source.conferencedate | 2025-09-24 | |
| dc.source.conferencelocation | Grenoble | |
| dc.source.endpage | 4 | |
| dc.source.journal | 2025 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES, SISPAD | |
| dc.source.numberofpages | 4 | |
| dc.title | Layer and Stacking Effects on Transport Properties in Steep-Slope Cold-Metal-Source FETs | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| imec.internal.crawledAt | 2025-10-22 | |
| imec.internal.source | crawler | |
| imec.internal.wosCreatedAt | 2026-09-13 | |
| Files | ||
| Publication available in collections: |