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Conference contributions
A calibrated FEM study of the influence of line width, line spacing and dielectric E modulus on stress and stress gradients in BEOL copper interconnects
Publication:
A calibrated FEM study of the influence of line width, line spacing and dielectric E modulus on stress and stress gradients in BEOL copper interconnects
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Date
2012
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24690.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Lofrano, Melina
;
Wilson, Chris
;
Croes, Kristof
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Abstract
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2047
since deposited on 2021-10-20
Acq. date: 2025-12-15
Citations
Metrics
Views
2047
since deposited on 2021-10-20
Acq. date: 2025-12-15
Citations