Publication:

Barrier reliability of ALD TaN on sub-100 nm copper low-k interconnects

Date

2005
Proceedings Paper
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dc.contributor.authorTokei, Zsolt
dc.contributor.authorGailledrat, Thomas
dc.contributor.authorLi, Yunlong
dc.contributor.authorSchuhmacher, Jorg
dc.contributor.authorMandrekar, T.
dc.contributor.authorGuggilla, S.
dc.contributor.authorMebarki, B.
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.date.accessioned2021-10-16T05:44:54Z
dc.date.available2021-10-16T05:44:54Z
dc.date.embargo9999-12-31
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11325
dc.source.beginpage801
dc.source.conferenceAdanced Metallization Conference 2004
dc.source.conferencedate19/10/2004
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage805
dc.title

Barrier reliability of ALD TaN on sub-100 nm copper low-k interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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