Publication:

Impact of 1 $lm TSV via-last integration on electrical performance of advanced FinFET devices

Date

2018

Proceedings Paper

Simple item page Full metadata Statistics

Files

37109.pdf 1.24 MB

Author(s)

Hiblot, Gaspard

;

Van Huylenbroeck, Stefaan

;

Van der Plas, Geert

;

De Wachter, Bart

;

Vaisman Chasin, Adrian

;

;

Chiarella, Thomas

;

;

Demuynck, Steven

;

;

Metrics

1949 since deposited on 2021-10-25

1last month

Acq. date: 2025-12-17