Publication:

Impact of 1 $lm TSV via-last integration on electrical performance of advanced FinFET devices

Date

2018

Proceedings Paper

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Files

37109.pdf 1.24 MB

Author(s)

Hiblot, Gaspard

;

Van Huylenbroeck, Stefaan

;

Van der Plas, Geert

;

De Wachter, Bart

;

Vaisman Chasin, Adrian

;

;

Chiarella, Thomas

;

;

Demuynck, Steven

;

;

Statistics

1950 since deposited on 2021-10-25

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Acq. date: 2026-02-26