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Suitability of Half-Wavelength Contact Acoustic Microscopy to detect deeply buried voids

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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-7503-8922
cris.virtual.orcid0000-0002-6554-7205
cris.virtualsource.department9a3d60e7-3e8b-4366-b479-ea599b23d28b
cris.virtualsource.department3b854db4-1f5f-434c-bcb2-498e6b938dc9
cris.virtualsource.orcid9a3d60e7-3e8b-4366-b479-ea599b23d28b
cris.virtualsource.orcid3b854db4-1f5f-434c-bcb2-498e6b938dc9
dc.contributor.authorvan Neer, P. L. M. J.
dc.contributor.authorvan Willigen, D. M.
dc.contributor.authorHorchens, L.
dc.contributor.authorGerritsma, A. M.
dc.contributor.authorBogdanowicz, Janusz
dc.contributor.authorChen, Cong
dc.contributor.authorQuesson, B. A. J.
dc.contributor.imecauthorBogdanowicz, J.
dc.contributor.imecauthorChen, C.
dc.date.accessioned2025-07-28T03:57:28Z
dc.date.available2025-07-28T03:57:28Z
dc.date.issued2025
dc.identifier.doi10.1117/12.3050820
dc.identifier.eisbn978-1-5106-8639-7
dc.identifier.isbn978-1-5106-8638-0
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45955
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.beginpage134261M-1
dc.source.conference2025 Conference on Metrology Inspection and Process Control-Annual
dc.source.conferencedate2025-02-24
dc.source.conferencelocationSan Jose
dc.source.endpage134261M-4
dc.source.journalProceedings of SPIE
dc.source.numberofpages4
dc.title

Suitability of Half-Wavelength Contact Acoustic Microscopy to detect deeply buried voids

dc.typeProceedings paper
dspace.entity.typePublication
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