Publication:

Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials

Date

2014
Proceedings Paper
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dc.contributor.authorCadacio Jr., Francisco
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorDaily, Robert
dc.contributor.authorGerets, Carine
dc.contributor.authorDuval, Fabrice
dc.contributor.authorWang, Teng
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T00:51:08Z
dc.date.available2021-10-22T00:51:08Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23597
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7028355
dc.source.beginpage444
dc.source.conference16th IEEE Electronic Packaging Technology Conference - EPTC
dc.source.conferencedate3/12/2014
dc.source.conferencelocationSingapore Singapore
dc.source.endpage448
dc.title

Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials

dc.typeProceedings paper
dspace.entity.typePublication
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