Publication:

CMOS compatible anodization process for low cost high density capacitors

Date

2010
Meeting abstract
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dc.contributor.authorDetalle, Mikael
dc.contributor.authorRakowski, Michal
dc.contributor.authorPotoms, Goedele
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorde Potter de ten Broeck, Muriel
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorSoussan, Philippe
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorRakowski, Michal
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorde Potter de ten Broeck, Muriel
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.date.accessioned2021-10-18T16:01:12Z
dc.date.available2021-10-18T16:01:12Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17014
dc.identifier.urlhttp://ecsmeet3.peerx-press.org/ms_files/ecsmeet3/2010/05/10/00003300/00/3300_0_art_0_l27mhd.pdf
dc.source.beginpage1682
dc.source.conference218th ECS Meeting Symposium 'Processing, Materials, and Integration of Damascene and 3D Interconnects'
dc.source.conferencedate10/10/2010
dc.source.conferencelocationLas Vegas, NV USA
dc.title

CMOS compatible anodization process for low cost high density capacitors

dc.typeMeeting abstract
dspace.entity.typePublication
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