Publication:
Multi-scale modeling of direct copper plating on resistive non-copper substrates
Date
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0003-4115-0075 | |
| cris.virtual.orcid | 0000-0002-6699-1615 | |
| cris.virtualsource.department | 319bcb05-51e0-4ebd-82cd-03314b82dce9 | |
| cris.virtualsource.department | 12de27c7-869f-445c-8ac5-1dad7854aab4 | |
| cris.virtualsource.orcid | 319bcb05-51e0-4ebd-82cd-03314b82dce9 | |
| cris.virtualsource.orcid | 12de27c7-869f-445c-8ac5-1dad7854aab4 | |
| dc.contributor.author | Yang, Liu | |
| dc.contributor.author | Radisic, Alex | |
| dc.contributor.author | Nagar, Magi | |
| dc.contributor.author | Deconinck, Johan | |
| dc.contributor.author | Vereecken, Philippe | |
| dc.contributor.author | West, Alan | |
| dc.contributor.imecauthor | Radisic, Alex | |
| dc.contributor.imecauthor | Vereecken, Philippe | |
| dc.contributor.orcidimec | Vereecken, Philippe::0000-0003-4115-0075 | |
| dc.date.accessioned | 2021-10-20T19:12:09Z | |
| dc.date.available | 2021-10-20T19:12:09Z | |
| dc.date.issued | 2012 | |
| dc.identifier.issn | 0013-4686 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/21875 | |
| dc.identifier.url | http://dx.doi.org/10.1016/j.electacta.2012.06.076 | |
| dc.source.beginpage | 524 | |
| dc.source.endpage | 531 | |
| dc.source.journal | Electrochimica Acta | |
| dc.source.volume | 78 | |
| dc.title | Multi-scale modeling of direct copper plating on resistive non-copper substrates | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |