Publication:
Evaluation of energy-recovering interconnects for low-power 3D stacked ICs
Date
| dc.contributor.author | Asimakopoulos, Panagiotis | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Yakovlev, A. | |
| dc.contributor.author | Marchal, Pol | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.date.accessioned | 2021-10-17T21:18:27Z | |
| dc.date.available | 2021-10-17T21:18:27Z | |
| dc.date.issued | 2009 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14916 | |
| dc.source.beginpage | 1 | |
| dc.source.conference | IEEE International Conference on 3D System Integration - 3DIC | |
| dc.source.conferencedate | 28/09/2009 | |
| dc.source.conferencelocation | San Francisco, CA USA | |
| dc.source.endpage | 5 | |
| dc.title | Evaluation of energy-recovering interconnects for low-power 3D stacked ICs | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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