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Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects

Date

2009
Proceedings Paper
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dc.contributor.authorMertens, Paul
dc.contributor.authorKim, Tae-Gon
dc.contributor.authorClaes, Martine
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorVereecke, Guy
dc.contributor.authorKesters, Els
dc.contributor.authorSuhard, Samuel
dc.contributor.authorPacco, Antoine
dc.contributor.authorLux, Marcel
dc.contributor.authorKenis, Karine
dc.contributor.authorUrbanowicz, Adam
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyer, Gerald
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorPacco, Antoine
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.accessioned2021-10-18T00:46:38Z
dc.date.available2021-10-18T00:46:38Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15856
dc.source.beginpage237
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate1/06/2009
dc.source.conferencelocationSapporo Japan
dc.source.endpage239
dc.title

Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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