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Mixed assembly on PCB of wide variety components (MCM-D, SMDs, bare dies) using wire bonding and SMT

Date

2002
Proceedings Paper
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dc.contributor.authorStoukatch, Serguei
dc.contributor.authorVaesen, Kristof
dc.contributor.authorHo, Meng
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T23:16:14Z
dc.date.available2021-10-14T23:16:14Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6854
dc.source.beginpage1671
dc.source.conferenceProceedings 52nd Electronic Components and Technology Conference
dc.source.conferencedate28/05/2002
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage1674
dc.title

Mixed assembly on PCB of wide variety components (MCM-D, SMDs, bare dies) using wire bonding and SMT

dc.typeProceedings paper
dspace.entity.typePublication
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