Publication:

Temporary wafer bonding defect impact assessment on substrate thinning, process enhancement through systematic defect track down

Date

2012
Proceedings Paper
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dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorSuhard, Samuel
dc.contributor.authorBex, Pieter
dc.contributor.authorVan den Eede, Axel
dc.contributor.authorPancken, Joris
dc.contributor.authorLismont, Mark
dc.contributor.authorJourdain, Anne
dc.contributor.authorWoitke, Tobias
dc.contributor.authorBisson, Peter
dc.contributor.authorSpiess, Walter
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorVan den Eede, Axel
dc.contributor.imecauthorPancken, Joris
dc.contributor.imecauthorLismont, Mark
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-20T14:36:07Z
dc.date.available2021-10-20T14:36:07Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21304
dc.source.beginpage1255
dc.source.conferenceIEEE 62nd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2012
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage1259
dc.title

Temporary wafer bonding defect impact assessment on substrate thinning, process enhancement through systematic defect track down

dc.typeProceedings paper
dspace.entity.typePublication
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