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Integration of photodetectors with lasers for optical interconnects using 200 mm waferscale III-V/SOI technology

Date

2011-03
Proceedings Paper
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dc.contributor.authorSpuesens, Thijs
dc.contributor.authorLiu, Liu
dc.contributor.authorVermeulen, Diedrik
dc.contributor.authorZhao, Jing
dc.contributor.authorRomeo, Pedro Rojo
dc.contributor.authorRegreny, Rhilippe
dc.contributor.authorGrenouillet, Laurent
dc.contributor.authorFedeli, J.M.
dc.contributor.authorVan Thourhout, Dries
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.date.accessioned2021-10-19T19:08:33Z
dc.date.available2021-10-19T19:08:33Z
dc.date.embargo9999-12-31
dc.date.issued2011-03
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19821
dc.source.beginpageJThA27
dc.source.conferenceOptical Fiber Communication Conference and Exposition/National Fiber Optic Engineers Conference - OFCNFOEC
dc.source.conferencedate6/03/2011
dc.source.conferencelocationLos Angeles, CA USA
dc.title

Integration of photodetectors with lasers for optical interconnects using 200 mm waferscale III-V/SOI technology

dc.typeProceedings paper
dspace.entity.typePublication
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