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Modelling and characterisation of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification

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dc.contributor.authorChandrasekhar, Arun
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDriessens, Evelien
dc.contributor.authorPieters, Philip
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorVan Puymbroeck, Jan
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.imecauthorVan Puymbroeck, Jan
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.accessioned2021-10-14T16:41:15Z
dc.date.available2021-10-14T16:41:15Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5134
dc.source.beginpage141
dc.source.conferenceProceedings 51st Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2001
dc.source.conferencelocationOrlando, Fl USA
dc.source.endpage148
dc.title

Modelling and characterisation of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification

dc.typeProceedings paper
dspace.entity.typePublication
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