Publication:

Three-layer BEOL process integration with supervia and self-aligned-block options for the 3nm node

Date

2019
Proceedings Paper
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dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorWilson, Chris
dc.contributor.authorBriggs, Basoene
dc.contributor.authorDecoster, Stefan
dc.contributor.authorVersluijs, Janko
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorPaolillo, Sara
dc.contributor.authorBaert, Rogier
dc.contributor.authorPuliyalil, Harinarayanan
dc.contributor.authorBekaert, Joost
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorLorant, Christophe
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorTeugels, Lieve
dc.contributor.authorHeylen, Nancy
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorWebers, Tomas
dc.contributor.authorVats, Hemant
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorBriggs, Basoene
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorPaolillo, Sara
dc.contributor.imecauthorBaert, Rogier
dc.contributor.imecauthorPuliyalil, Harinarayanan
dc.contributor.imecauthorBekaert, Joost
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorLorant, Christophe
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorVats, Hemant
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecPuliyalil, Harinarayanan::0000-0002-9749-5307
dc.contributor.orcidimecBekaert, Joost::0000-0003-3075-3479
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecLorant, Christophe::0000-0001-7363-9348
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecLee, Jae Uk::0000-0002-9434-5055
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecBoccardi, Guillaume::0000-0003-3226-4572
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecDebacker, Peter::0000-0003-3825-5554
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-27T22:10:53Z
dc.date.available2021-10-27T22:10:53Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34337
dc.source.beginpage454
dc.source.conferenceIEEE International Electron Devices Meeting - IEDM
dc.source.conferencedate7/12/2019
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage457
dc.title

Three-layer BEOL process integration with supervia and self-aligned-block options for the 3nm node

dc.typeProceedings paper
dspace.entity.typePublication
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