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Effect of ionic strength and the electrolyte composition on the suppression of copper deposition by PEG

Date

2010
Proceedings Paper
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dc.contributor.authorAtanasova, Tanya
dc.contributor.authorStrubbe, Katrien
dc.contributor.authorVereecken, Philippe
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.accessioned2021-10-18T15:16:35Z
dc.date.available2021-10-18T15:16:35Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16677
dc.source.beginpage67
dc.source.conferenceFundamentals of Electrochemical Growth: From UPD to Microstructures - Symposium in Memory of Prof. Evgeni Budevski
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
dc.source.endpage78
dc.title

Effect of ionic strength and the electrolyte composition on the suppression of copper deposition by PEG

dc.typeProceedings paper
dspace.entity.typePublication
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