Publication:
Understanding adhesion failure in low-k dielectric stacks during chemical mechanical polishing
Date
| dc.contributor.author | Iacopi, Francesca | |
| dc.contributor.author | Degryse, Dominiek | |
| dc.contributor.author | Vos, Ingrid | |
| dc.contributor.author | Patz, Michael | |
| dc.contributor.author | Maex, Karen | |
| dc.contributor.imecauthor | Vos, Ingrid | |
| dc.contributor.imecauthor | Maex, Karen | |
| dc.date.accessioned | 2021-10-15T14:00:33Z | |
| dc.date.available | 2021-10-15T14:00:33Z | |
| dc.date.issued | 2004-01 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9082 | |
| dc.source.beginpage | 131 | |
| dc.source.conference | Thin Film - Stresses and Mechanical Properties X | |
| dc.source.conferencedate | 1/12/2003 | |
| dc.source.conferencelocation | Boston, MA USA | |
| dc.source.endpage | 136 | |
| dc.title | Understanding adhesion failure in low-k dielectric stacks during chemical mechanical polishing | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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