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Conference contributions
Cu electrodeposition for Through-Silicon Via Technology
Publication:
Cu electrodeposition for Through-Silicon Via Technology
Date
2009
Meeting abstract
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Philipsen, Harold
;
Luhn, Ole
;
Sabuncuoglu Tezcan, Deniz
;
Civale, Yann
;
Ruythooren, Wouter
Journal
Abstract
Description
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Views
1950
since deposited on 2021-10-18
Acq. date: 2025-10-24
Citations
Metrics
Views
1950
since deposited on 2021-10-18
Acq. date: 2025-10-24
Citations