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A Fully Packaged 140 GHz Analog Radio-over-Fiber Transmitter Chipset with SiGe driver and TFLN modulator PIC

 
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cris.virtual.orcid0000-0003-0609-1145
cris.virtual.orcid0000-0003-1817-5370
cris.virtual.orcid0000-0002-9381-3865
cris.virtualsource.department1c0583af-6504-42b1-96c7-64c3532d3317
cris.virtualsource.departmentb495c208-a27d-49b2-a309-8acaef1f1428
cris.virtualsource.departmentfdd7ce55-4cef-4d26-9d12-ebb7247c8ccd
cris.virtualsource.orcid1c0583af-6504-42b1-96c7-64c3532d3317
cris.virtualsource.orcidb495c208-a27d-49b2-a309-8acaef1f1428
cris.virtualsource.orcidfdd7ce55-4cef-4d26-9d12-ebb7247c8ccd
dc.contributor.authorBroucke, Reinier
dc.contributor.authorObara, Karol
dc.contributor.authorZarebidaki, Homa
dc.contributor.authorLeo, Jacopo
dc.contributor.authorPietro, Ivan
dc.contributor.authorSattari, Hamed
dc.contributor.authorSingh, Nishant
dc.contributor.authorTorfs, Guy
dc.date.accessioned2026-07-23T11:58:11Z
dc.date.available2026-07-23T11:58:11Z
dc.date.createdwos2026
dc.date.issued2025
dc.description.abstractAn experimental demonstration of an integrated 140 GHz analog radio-over-fiber transmitter chipset is presented. The chipset consists of a single-ended push-pull Mach-Zehnder modulator on a TFLN PIC with a flip-chipped 130 nm SiGe PA. The chipset achieves an electro-optic 3 dB bandwidth of 20 GHz at a center frequency of 130 GHz and is shown to support data rates of 2 Gbps.
dc.description.wosFundingTextThis work was supported by the Horizon Europe PATTERN project (grant no 101070506), through a PhD fellowship by the Research Foundation Flanders and through a Research Foundation Flanders SB project (grant number 3G035722).
dc.identifier.doi10.1109/mwp65272.2025.11371824
dc.identifier.isbn979-8-3315-9726-9
dc.identifier.issn2835-3501
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59932
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.relation.ispartofseriesInternational Topical Meeting on Microwave Photonics
dc.source.beginpage1
dc.source.conferenceIEEE International Topical Meeting on Microwave Photonics (MWP)
dc.source.conferencedate2025-10-14
dc.source.conferencelocationQuebec
dc.source.endpage4
dc.source.journal2025 IEEE INTERNATIONAL TOPICAL MEETING ON MICROWAVE PHOTONICS, MWP
dc.source.numberofpages4
dc.title

A Fully Packaged 140 GHz Analog Radio-over-Fiber Transmitter Chipset with SiGe driver and TFLN modulator PIC

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2026-02-20
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-07-14
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